HP Additive Manufacturing hosts March 31 webinar showcasing the new HP IF 600HT system for high-temperature engineering polymers.

HP Additive Manufacturing is set to host a major webinar on March 31, 2026, promising to unveil what it calls the future of industrial filament 3D printing.

The HP IF 600HT System

The upcoming webinar will showcase the HP Industrial Filament 600 High Temperature (HT) system, which the company debuted at Formnext 2025. The system represents HP's entry into the high-performance filament printing market, targeting demanding engineering applications.

Modular Design for Multiple Materials

Key features of the HP IF 600HT include:

  • Modular printhead system — Interchangeable printing modules for different temperature requirements
  • 280°C module — For ABS and carbon-filled materials
  • 360°C module — For PEI (Ultem) and polycarbonate applications
  • 500°C module — For PEEK, PAEK, and advanced high-temperature polymers

HP AM Quality Meets Open Materials

The system combines HP's trusted industrial quality with an open materials platform, allowing users to print with third-party filaments while benefiting from HP's established support infrastructure.

An associated material management system (MMS) provides filament storage and drying capabilities, similar to the AMS systems popularised by Bambu Lab, but designed for industrial environments.

Why Industrial Filament Matters

While desktop 3D printers have dominated consumer attention, industrial filament systems fill a crucial gap between hobbyist machines and expensive metal AM systems. The ability to produce engineering-grade thermoplastics like PEEK and PEI at scale opens opportunities in:

  • Aerospace interior components
  • Automotive functional parts
  • Medical device prototypes
  • Industrial tooling and jigs

What to Expect

The March 31 webinar will likely provide detailed specifications, pricing, and availability for the HP IF 600HT, along with application examples and customer testimonials. Registration is now open at HP events.

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