Matrix6D maglev platform brings additive manufacturing to semiconductor packaging production.
Additive Electronics Meets Semiconductors
Advanced Printed Electronics Solutions (APES) has partnered with Great Lakes Semiconductor (GLS) to integrate the Matrix6D platform into semiconductor packaging production.
What Is Matrix6D?
The Matrix6D is a modular 3D printing platform with maglev conveyor platforms that travel between different print heads. This enables multi-process workflows: polymer deposition, circuit printing, milling, and final assembly in one automated system.
Strategic Focus
The partnership targets automotive sensors, wireless communication devices, and defense electronics. These sectors need customized chip packaging that traditional semiconductor manufacturing cannot easily provide.
Operations begin at APES lab in Fishkill, New York, moving to GLS facilities by Q3 2026.
Why It Matters
This validates additively manufactured electronics as production technology. The semiconductor industry is taking AME seriously for advanced packaging applications.
Comments (0)
No comments yet. Be the first!
Leave a Comment