XTPL Partners with Manz Asia: 3D Printed Electronics Enters the Semiconductor Big League

XTPL Enters the Semiconductor Supply Chain

Polish additive manufacturing company XTPL has announced a strategic partnership with Manz Asia, a leading semiconductor capital equipment manufacturer. The deal centers on XTPL's Delta Printing System (DPS) and its Ultra-Precise Dispensing (UPD) technology.

Manz Asia has acquired one of XTPL's DPS units, which will be installed at the Manz Semiconductor Innovation R&D Center in Taiwan in the first half of 2026. This partnership represents XTPL's foothold in the world's most critical semiconductor manufacturing region.

Why This Matters for 3D Printed Electronics

Chip packaging—housing semiconductors to protect them and enable connectivity—has become a battleground for innovation. As Moore's Law slows, manufacturers are stacking chips vertically (chiplets) to boost performance. This is where additive manufacturing steps in.

XTPL's UPD technology can deposit both conductive and non-conductive materials with micron-level precision on 2D, 2.5D, and 3D substrates. This makes it ideal for advanced semiconductor packaging applications.

"The synergy between XTPL's unique ultra-precise dispensing technology and Manz Asia's competencies in advanced semiconductor packaging is a natural fit," said Filip Granek, CEO of XTPL.

The Geopolitical Angle

While this is a business story, there's a larger context. China has led the charge in chiplet technology due to export restrictions on advanced chip-making equipment. The West is now playing catch-up, investing heavily in domestic semiconductor production.

If XTPL's technology proves itself in Taiwan—the global semiconductor hub—it could become a key part of future reshoring efforts in the US and Europe. The partnership could also pave the way for integrating XTPL's printhead directly into Manz Asia's manufacturing machines.