XTPL Sells First ODRA System to Silicon Valley — Ultra-Precise 3D Printing for Advanced Semiconductor Packaging

Advanced Packaging Gets Precise

The semiconductor industry is increasingly turning to additive manufacturing for advanced chip packaging — stacking chips vertically rather than side-by-side to improve performance and efficiency. Poland's XTPL is positioning itself at the forefront of this trend.

XTPL announced it has sold its first ODRA system — the production-level version of the company's Delta Printing System (DPS) — to a Silicon Valley client that provides advanced packaging solutions for both the tech and defense sectors.

From R&D to Production

Unlike the DPS, which is primarily used for R&D, the ODRA system is designed for HMLV (High-Mix, Low-Volume) industrial production. The system leverages XTPL's Ultra-Precise Dispensing (UPD) printhead technology.

The ODRA unit is priced at approximately $400,000–$500,000 — more than twice the value of the DPS technology demonstrator. Installation is scheduled for the second half of 2026.

Strategic Win

The client is a member of the US-JOINT Consortium, an international group established to build an advanced semiconductor packaging R&D center in Silicon Valley. The consortium includes members from Japan and the US, including Japanese chemicals manufacturer Resonac.

XTPL's CEO Filip Granek called the sale a breakthrough moment that provides market validation for their new business line. The Silicon Valley client has already expressed interest in purchasing additional ODRA systems.

XTPL previously sold a DPS system to a different Silicon Valley client in 2025, showing the company's ability to convert R&D customers into production customers.